rev.2.00 sep 15, 2006 page 1 of 4 HSB226S silicon schottky barrier di ode for high speed switching rej03g0591-0200 rev.2.00 sep 15, 2006 features ? low reverse current, low capacitance. ? cmpak package is suitable for high density surface mounting and high speed assembly. ordering information type no. laser mark package name package code HSB226S e7 cmpak ptsp0003zb-a pin arrangement 1. cathode 2 2. anode 1 3. cathode 1 anode 2 (top view) 21 3
HSB226S rev.2.00 sep 15, 2006 page 2 of 4 absolute maximum ratings (ta = 25 c) item symbol value unit repetitive peak reverse voltage v rrm 25 v non-repetitive peak forward surge current i fsm * 1 * 2 200 ma forward current i f * 2 50 ma junction temperature tj 125 c storage temperature tstg ? 55 to +125 c notes: 1. 10 ms sine wave 1 pulse 2. two device total electrical characteristics * (ta = 25 c) item symbol min typ max unit test condition v f1 ? ? 0.33 i f = 1 ma forward voltage v f2 ? ? 0.38 v i f = 5 ma reverse current i r ? ? 450 na v r = 20 v capacitance c ? ? 2.80 pf v r = 1 v, f = 1 mhz note: per one device
HSB226S rev.2.00 sep 15, 2006 page 3 of 4 main characteristic 10 10 1.0 0.1 0.1 1.0 f = 1mhz capacitance c (pf) reverse voltage v r (v) fig.3 capacitance vs. reverse voltage 1.0 00.40.6 0.2 0.8 10 ?1 10 ?7 10 ?3 10 ?5 10 1 10 ?2 10 ?8 10 ?4 10 ?6 10 0 ta = 25 c ta = 75 c forward voltage v f (v) fig.1 forward current vs. forward voltage forward current i f (a) 010 10 ?4 40 10 ?7 30 20 10 ?5 10 ?6 10 ?8 ta = 25 c ta = 75 c reverse voltage v r (v) fig.2 reverse current vs. reverse voltage reverse current i r (a)
HSB226S rev.2.00 sep 15, 2006 page 4 of 4 package dimensions pattern of terminal position areas e e 1 l 1 b 2 d aa b e h e e a 2 a a 1 q c l a0.8-1.1 a 1 0-0.1 a 2 0.8 0.9 1.0 b 0.25 0.3 0.4 c 0.1 0.16 0.26 d1.82.02.2 e 1.15 1.25 1.35 -0.65- e h e 1.8 2.1 2.4 l 0.425 -- b 2 - - 0.45 -1.5- e 1 l 1 --0.9 q-0.2- dimension in millimeters min nom max reference symbol sc-70 0.006g mass[typ.] cmpak / cmpakv ptsp0003zb-a renesas code jeita package code previous code b c a ? a section
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is a lways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placeme nt of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies o r errors. please also pay attention to information published by renesas technology corp. by various means, including the renesas techn ology corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under ci rcumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materi als. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology (shanghai) co., ltd. unit 204, 205, aziacenter, no.1233 lujiazui ring rd, pudong district, shanghai, china 200120 tel: <86> (21) 5877-1818, fax: <86> (21) 6887-7898 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2730-6071 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas technology korea co., ltd. kukje center bldg. 18th fl., 191, 2-ka, hangang-ro, yongsan-ku, seoul 140-702, korea tel: <82> (2) 796-3115, fax: <82> (2) 796-2145 renesas technology malaysia sdn. bhd unit 906, block b, menara amcorp, amcorp trade centre, no.18, jalan persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: <603> 7955-9390, fax: <603> 7955-9510 renesas sales offices ? 200 6. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .6.0
|
